DocumentCode :
556356
Title :
Modeling of power devices with Drift Region Integrated Microchannel Cooler
Author :
Vladimirova, Kremena ; Avenas, Yvan ; Crebier, Jean-Christophe ; Schaeffer, Christian ; Lebouc, Fabien ; Tawk, Mansour
Author_Institution :
Grenoble Electr. Eng. Lab. (G2Elab), St. Martin d´´Hères, France
fYear :
2011
fDate :
27-29 Sept. 2011
Firstpage :
1
Lastpage :
6
Abstract :
This paper introduces the DRIMCooler - an innovative concept allowing to locate the heat exchanger directly inside the active region of a vertical power device. Based on vertical edge termination technique and the use of dielectric coolant fluid circulation, arrays of through wafer channels are drilled in the silicon substrate offering a large heat exchange coefficient while minimizing the pressure drops. The concept is introduced and discussed with respect to technological and electrical points of view. Thermal and fluidic issues are analyzed with numerical models and simulations. The obtained results show excellent thermal and hydraulic performances of the DRIM Cooler.
Keywords :
coolants; cooling; fluidics; heat exchangers; hydraulic fluids; numerical analysis; power electronics; silicon; dielectric coolant fluid circulation; drift region integrated microchannel cooler; fluidic issue; heat exchanger; hydraulic performance; numerical simulation; power device modeling; silicon substrate; thermal issue; thermal performance; vertical edge termination technique; vertical power device; Coolants; Dielectrics; Fluids; Heat transfer; Heating; Metals;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal Investigations of ICs and Systems (THERMINIC), 2011 17th International Workshop on
Conference_Location :
Paris
Print_ISBN :
978-1-4577-0778-0
Type :
conf
Filename :
6081005
Link To Document :
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