Enhanced package- and die-level defect localization by dynamic lock-in thermography

Recent improvements of microscopic Lock-In Thermography (LIT) offer the non-destructive localization of thermally active defects like shorts or resistive opens, even through the full package. This paper briefly discusses LIT based analysis flow highlighting benefits of the combination with 3D x-ray. The main focus of the paper is to discuss and demonstrate different ways how to activate the thermally active defects with more complex Devices Under Test (DUTs)/defect signatures, requiring Automated Test Equipment (ATE) docking.