• DocumentCode
    556695
  • Title

    Defect depth effects in Pulsed Eddy Current thermography

  • Author

    Zhang, Hong ; Tian, Guiyun ; He, Yunze ; Zuo, Xianzhang

  • Author_Institution
    Sch. of Electr., Electron. & Comput. Eng., Univ. of Newcastle upon Tyne, Newcastle upon Tyne, UK
  • fYear
    2011
  • fDate
    10-10 Sept. 2011
  • Firstpage
    251
  • Lastpage
    254
  • Abstract
    In recent years, there has been an increasing interest in crack detecting and locating using Pulsed Eddy Current (PEC) thermography. PEC thermographic is an emerging integrative non-destructive testing (NDT) with the ability to inspect defects over large areas. The heating and diffusing results can be obtained easily and quickly from a thermal camera. In this paper, numerical modeling and experimental studies are applied to understand depth and tip effect on PEC thermography with different depths of defects, including transient heating propagation and magnetic flux distribution. This fundamental understanding of transient heating propagation and magnetic flux distribution will aid in the development of feature extraction and pattern recognition techniques for the quantitative analysis of PEC thermography images and crack characterisation.
  • Keywords
    crack detection; eddy current testing; feature extraction; infrared imaging; magnetic flux; nondestructive testing; NDT; PEC thermography; crack detection; defect depth effects; feature extraction; integrative nondestructive testing; magnetic flux distribution; numerical modeling; pattern recognition techniques; pulsed eddy current thermography; quantitative analysis; thermal camera; transient heating propagation; Coils; Eddy currents; Heating; Inspection; Magnetic fields; Magnetic flux; Materials; Crack-tip; Finite element modelling; Magnetic flux; NDT; PEC; Thermography;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Automation and Computing (ICAC), 2011 17th International Conference on
  • Conference_Location
    Huddersfield
  • Print_ISBN
    978-1-4673-0000-1
  • Type

    conf

  • Filename
    6084936