Title :
3R on nickel silicidation: Reduction of CoO for Ni-Pt sputtering
Author :
Futase, Takuya ; Tanimoto, Hisanori
Abstract :
Presents a collection of slides covering the following topics: A platinum mine in chamber parts after Ni-Pt sputtering; parts treatment: physical and chemical treatments; high selective novel solvent for Ni-Pt/stainless Integrity of parts treated by the novel solvent Pt recovery efficiency and cost effects.
Keywords :
nickel; platinum; sputtering; Ni-Pt sputtering; Ni-Pt/stainless integrity; chamber parts; nickel silicidation; platinum mine; solvent; Films; Nickel; Recycling; Silicidation; Solvents; Sputtering;
Conference_Titel :
Semiconductor Manufacturing (ISSM) and e-Manufacturing and Design Collaboration Symposium (eMDC), 2011 International Symposium on
Conference_Location :
Hsinchu
Print_ISBN :
978-1-4577-1647-8
