DocumentCode
556824
Title
3R on nickel silicidation: Reduction of CoO for Ni-Pt sputtering
Author
Futase, Takuya ; Tanimoto, Hisanori
fYear
2011
fDate
5-6 Sept. 2011
Firstpage
1
Lastpage
15
Abstract
Presents a collection of slides covering the following topics: A platinum mine in chamber parts after Ni-Pt sputtering; parts treatment: physical and chemical treatments; high selective novel solvent for Ni-Pt/stainless Integrity of parts treated by the novel solvent Pt recovery efficiency and cost effects.
Keywords
nickel; platinum; sputtering; Ni-Pt sputtering; Ni-Pt/stainless integrity; chamber parts; nickel silicidation; platinum mine; solvent; Films; Nickel; Recycling; Silicidation; Solvents; Sputtering;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Manufacturing (ISSM) and e-Manufacturing and Design Collaboration Symposium (eMDC), 2011 International Symposium on
Conference_Location
Hsinchu
ISSN
1523-553X
Print_ISBN
978-1-4577-1647-8
Type
conf
Filename
6086051
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