DocumentCode
556825
Title
Avoiding low flow conditions for filters used in wet cleaning processes
Author
Hashimoto, Masatoshi ; Tsuzuki, Shuichi ; Numaguchi, Toru ; Miyazaki, Namio
fYear
2011
fDate
5-6 Sept. 2011
Firstpage
1
Lastpage
10
Abstract
We report on a key factor that can increase the dewetting risk and demonstrate how using Molecular Surface Tailoring technology (MST) decreases the risk of dewetting.
Keywords
cleaning; filters; semiconductor device manufacture; surface treatment; dewetting risk; filters; low flow conditions; molecular surface tailoring technology; wet cleaning processes; Chemicals; Cleaning; Collaboration; Joints; Laboratories; Manufacturing; Production facilities;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Manufacturing (ISSM) and e-Manufacturing and Design Collaboration Symposium (eMDC), 2011 International Symposium on
Conference_Location
Hsinchu
ISSN
1523-553X
Print_ISBN
978-1-4577-1647-8
Type
conf
Filename
6086052
Link To Document