DocumentCode :
556825
Title :
Avoiding low flow conditions for filters used in wet cleaning processes
Author :
Hashimoto, Masatoshi ; Tsuzuki, Shuichi ; Numaguchi, Toru ; Miyazaki, Namio
fYear :
2011
fDate :
5-6 Sept. 2011
Firstpage :
1
Lastpage :
10
Abstract :
We report on a key factor that can increase the dewetting risk and demonstrate how using Molecular Surface Tailoring technology (MST) decreases the risk of dewetting.
Keywords :
cleaning; filters; semiconductor device manufacture; surface treatment; dewetting risk; filters; low flow conditions; molecular surface tailoring technology; wet cleaning processes; Chemicals; Cleaning; Collaboration; Joints; Laboratories; Manufacturing; Production facilities;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Manufacturing (ISSM) and e-Manufacturing and Design Collaboration Symposium (eMDC), 2011 International Symposium on
Conference_Location :
Hsinchu
ISSN :
1523-553X
Print_ISBN :
978-1-4577-1647-8
Type :
conf
Filename :
6086052
Link To Document :
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