DocumentCode :
556842
Title :
New method of particle management by high-sensitivity ISPM
Author :
Matsui, Hidefumi ; Miyauchi, K. ; Nagaike, H. ; Moriya, T. ; Oshima, C. ; Hayamizu, T. ; Sakamori, S. ; Watanabe, S.
fYear :
2011
fDate :
5-6 Sept. 2011
Firstpage :
1
Lastpage :
11
Abstract :
A collection of slides from the authors´ conference presentation about New method of particle management by high-sensitivity ISPM is presented.
Keywords :
laser beam etching; semiconductor device manufacture; dry etching; high sensitivity ISPM; particle management; Collaboration; Dry etching; Joints; Manufacturing; Semiconductor lasers; Sensitivity; Vacuum systems;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Manufacturing (ISSM) and e-Manufacturing and Design Collaboration Symposium (eMDC), 2011 International Symposium on
Conference_Location :
Hsinchu
ISSN :
1523-553X
Print_ISBN :
978-1-4577-1647-8
Type :
conf
Filename :
6086069
Link To Document :
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