• DocumentCode
    556844
  • Title

    Scratch reduction in oxide CMP process

  • Author

    Ohtsuka, Yosuke

  • Author_Institution
    Renesas Electronics Corporation
  • fYear
    2011
  • fDate
    5-6 Sept. 2011
  • Firstpage
    1
  • Lastpage
    10
  • Abstract
    • Pulsation of diaphragm gives high stress to slurry, and that result in agglomeration of slurry abrasives. • By applying maglev centrifugal pump, scratch trend was clearly improved. • It´s important that the distribution pump doesn´t give stress to slurry.
  • Keywords
    Adhesives; Availability; Fluids; Joints; Pumps; Slurries;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing (ISSM) and e-Manufacturing and Design Collaboration Symposium (eMDC), 2011 International Symposium on
  • Conference_Location
    Hsinchu, Taiwan
  • ISSN
    1523-553X
  • Print_ISBN
    978-1-4577-1647-8
  • Type

    conf

  • Filename
    6086071
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=556844