Title :
Simulation analysis of relation between tool variability and cycle time
Author :
Okumura, Hiroyuki
Author_Institution :
Renesas Electronics Corporation
Abstract :
A collection of slides from the author´s conference presentation about the simulation analysis of relation between tool variability and cycle time is presented.
Keywords :
semiconductor device manufacture; cycle time; tool variability; Availability; Collaboration; Electric breakdown; Investments; Joints; Load modeling; Manufacturing;
Conference_Titel :
Semiconductor Manufacturing (ISSM) and e-Manufacturing and Design Collaboration Symposium (eMDC), 2011 International Symposium on
Conference_Location :
Hsinchu
Print_ISBN :
978-1-4577-1647-8
