Title :
Reduction of void defects on copper dual-damascene interconnect by integrated data-driven manufacturing
Author_Institution :
Panasonic Corporation
Abstract :
A collection of slides from the author´s conference presentation about the reduction of void defects on copper dual-damascene interconnect by integrated data-driven manufacturing is presented.
Keywords :
copper; interconnections; semiconductor device manufacture; semiconductor industry; voids (solid); copper dual damascene interconnect; integrated data driven manufacturing; void defects; Analytical models; Collaboration; Joints; Manufacturing; Metrology; Monitoring; Semiconductor device modeling;
Conference_Titel :
Semiconductor Manufacturing (ISSM) and e-Manufacturing and Design Collaboration Symposium (eMDC), 2011 International Symposium on
Conference_Location :
Hsinchu
Print_ISBN :
978-1-4577-1647-8
