• DocumentCode
    556859
  • Title

    Semiconductor tool monitor by integrating defect signatures and in-line WIP

  • Author

    Maheshwary, Sonu ; Ying, Hai ; Yong, Poh-Boon

  • fYear
    2011
  • fDate
    5-6 Sept. 2011
  • Firstpage
    1
  • Lastpage
    14
  • Abstract
    A collection of slides is presented by the author. Semiconductor manufacturing is discussed.
  • Keywords
    semiconductor device manufacture; defect signatures; in-line WIP; semiconductor manufacturing; semiconductor tool monitor; Handwriting recognition; IEEE Potentials; Monitoring; Production; Real time systems; Servers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing (ISSM) and e-Manufacturing and Design Collaboration Symposium (eMDC), 2011 International Symposium on
  • Conference_Location
    Hsinchu
  • ISSN
    1523-553X
  • Print_ISBN
    978-1-4577-1647-8
  • Type

    conf

  • Filename
    6086086
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=556859