• DocumentCode
    556899
  • Title

    24 GHz stacked power amplifier with optimum inter-stage matching using 0.13 μm CMOS process

  • Author

    Chang, Jiyoung ; Kim, Kihyun ; Lee, Sungho ; Nam, Sangwook

  • Author_Institution
    Sch. of Electr. Eng. & Comput. Sci., Seoul Nat. Univ., Seoul, South Korea
  • fYear
    2011
  • fDate
    26-30 Sept. 2011
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    A single-stage 24 GHz triple stacked power amplifier using 0.13 μm CMOS process is demonstrated. To Compare with parallel current combining method, series voltage combining method using a stacked amplifier architecture can realize a large output voltage swing from the top transistor without exceeding the transistor breakdown voltage limitations. However, at high frequencies, parasitic capacitances at the drain of each transistor become significant and it cause the phase difference between output current and voltage swing which degrades the performance of the power amplifier (PA). To solve this problem, the optimum inter-stage matching technique using inductors is introduced. With proposed optimum inter-stage matching method, the power amplifier performs a gain of 12.2 dB and saturated output power of 17.5 dBm with power added efficiency (PAE) of 20.5%. The 3dB output bandwidth is from 20.7-26.8 GHz.
  • Keywords
    CMOS analogue integrated circuits; inductors; power amplifiers; CMOS process; frequency 24 GHz; gain 12.2 dB; inductor; optimum interstage matching technique; parallel current combining method; parasitic capacitance; phase difference; power added efficiency; series voltage combining method; size 0.13 mum; stacked amplifier architecture; transistor breakdown; triple stacked power amplifier; voltage limitation; voltage swing; Capacitance; Impedance; Inductors; Logic gates; Power amplifiers; Power generation; Transistors; CMOS; power amplifier(PA); stacked transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Synthetic Aperture Radar (APSAR), 2011 3rd International Asia-Pacific Conference on
  • Conference_Location
    Seoul
  • Print_ISBN
    978-1-4577-1351-4
  • Type

    conf

  • Filename
    6086954