DocumentCode :
557464
Title :
Computational modeling analysis for cell growth using Electric Cell-substrate Impedance Sensing (ECIS) based time series data
Author :
Yang, Jen-Ming ; Chen, Szi-Wen ; Yang, Jhe-Hao ; Wang, Jong-Shyan
Author_Institution :
Dept. of Chem. & Mater. Eng., Chang Gung Univ., Taoyuan, Taiwan
Volume :
2
fYear :
2011
fDate :
15-17 Oct. 2011
Firstpage :
938
Lastpage :
941
Abstract :
In this paper, a computational modeling analysis on cell growth is presented. This study aims at deriving a mathematical model for cell growth in order to understand, analyze and predict the complex mechanisms of cell biological systems. The proposed model was derived and validated using the practically measured cell growth curves produced by an existing novel on-line monitoring technique, referred to as Electric Cell-substrate Impedance Sensing (ECIS). The model in the form of a time response function may reflect the resistance change as a result of cell proliferation. Model parameters were then estimated by fitting the measured time series impedance data to the model itself. Preliminary analysis results indicated that the computational model proposed in this study possessed good potentials to modeling analysis on cell growth and thus could provide a hopeful start for subsequent quantitative investigations into cell dynamics.
Keywords :
cellular biophysics; electric impedance measurement; electric sensing devices; mathematical analysis; time series; cell dynamics; cell growth; cell proliferation; computational modeling analysis; electric cell-substrate impedance sensing; mathematical model; on-line monitoring technique; time response function; time series impedance data; Computational modeling; Electrical resistance measurement; Electrodes; Immune system; Impedance; Resistance; Sensors; Electric Cell-substrate Impedance Sensing (ECIS); cell proliferation; modeling analysis; on-line cell monitoring;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Biomedical Engineering and Informatics (BMEI), 2011 4th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-9351-7
Type :
conf
DOI :
10.1109/BMEI.2011.6098447
Filename :
6098447
Link To Document :
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