DocumentCode
557580
Title
Study on the matrix and stress-strain relationship of laminated structure in the cranial cavity with the changing intracranial pressure
Author
Xianfang Yue ; Wang, Li ; Wang, Ruonan ; Yu, Hualin
Author_Institution
Dept. of Thermal Eng., Univ. of Sci. & Technol. Beijing, Beijing, China
Volume
1
fYear
2011
fDate
15-17 Oct. 2011
Firstpage
287
Lastpage
292
Abstract
Except the blood vessel in-out the cranial cavity and basicranial hole open onto skull, the cranial cavity can be totally regarded as one closed container. Intracranial Pressure (ICP) is fluctuant in brain. The cranial cavity will deform with the changing ICP, which is complex questions and can´t be solved the analytical solution. As a very effective numerical method, the finite element is used to analyze the deformation of cranial cavity. Cranial cavity is the hollow sphere formed by the skull and the duramater. There are obvious interfaces among the various parts of outer compact bone, middle cancellous bone, inner compact bone and duramater. In this paper, the matrix of laminated structure and stress-strain relationship of laminated structure have been set up in the cranial cavity, which will be the foundation to analyze the actual deformation of human skull-duramater system with the finite-element software.
Keywords
biomechanics; blood; blood vessels; bone; brain; deformation; finite element analysis; laminates; neurophysiology; pressure; stress-strain relations; Intracranial Pressure; analytical solution; basicranial hole open; blood vessel; brain; cranial cavity; duramater; effective numerical method; finite element analysis; finite-element software; inner compact bone; intracranial pressure; laminated structure; middle cancellous bone; outer compact; skull; stress-strain relationship; Cavity resonators; Cranial; Skull; Software; cranial cavity; intracranial pressure (ICP); laminated structure; matrix; stress-strain;
fLanguage
English
Publisher
ieee
Conference_Titel
Image and Signal Processing (CISP), 2011 4th International Congress on
Conference_Location
Shanghai
Print_ISBN
978-1-4244-9304-3
Type
conf
DOI
10.1109/CISP.2011.6099911
Filename
6099911
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