Title :
Antenna-in-package solution for millimeter-wave applications implemented in a microwave-compatible multilayer PCB technology
Author :
Enayati, Amin ; Deraedt, Walter ; Vandenbosch, Guy A E ; Räisänen, Antti V.
Author_Institution :
RFCDM Group, IMEC, Leuven, Belgium
Abstract :
A multi-layer PCB technology is used to implement an antenna-in-package solution for millimeter-wave-frequency applications. The antenna is a 1×2 array of dipoles fed by a vialess balun structure. The measurement and simulation results are compared for return loss and radiation pattern characteristics.
Keywords :
baluns; dipole antenna arrays; microwave antenna arrays; millimetre wave antenna arrays; antenna array; antenna-in-package solution; microwave-compatible multilayer PCB technology; millimeter-wave applications; radiation pattern characteristics; return loss; vialess balun structure; Antenna arrays; Antenna measurements; Antenna radiation patterns; Arrays; Dipole antennas; Loss measurement; antenna-in-package solutions; millimete-wave frequencies;
Conference_Titel :
Microwave Conference (EuMC), 2011 41st European
Conference_Location :
Manchester
Print_ISBN :
978-1-61284-235-6
