DocumentCode
558355
Title
Activities and progress of advanced microwave and system-in-package integration at National Taiwan University
Author
Wang, Huei ; Wu, Ruey-Beei ; Hsu, Powen ; Wu, Tzong-Lin ; Huang, Tain-Wei ; Tzuang, C-K Clive
Author_Institution
Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
fYear
2011
fDate
10-13 Oct. 2011
Firstpage
555
Lastpage
558
Abstract
The recent research efforts on advanced microwave and millimeter-wave (MMW) technologies and system-in-packaging (SiP) in National Taiwan University (NTU) are presented in this paper. The scope of our researches includes passive elements, monolithic microwave integrated circuits (MMICs), MMW SiP integration techniques, electromagnetic compatibility (EMC), and system integrations. Significant results have been achieved.
Keywords
MMIC; electromagnetic compatibility; system-in-package; MMIC; MMW SiP integration; National Taiwan University; electromagnetic compatibility; microwave technology; millimeter-wave technology; monolithic microwave integrated circuits; passive elements; system-in-package integration; Band pass filters; CMOS integrated circuits; Gain; Integrated circuit modeling; Microwave technology; Resonator filters; EMC; MMICs; SiP; passive components;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference (EuMC), 2011 41st European
Conference_Location
Manchester
Print_ISBN
978-1-61284-235-6
Type
conf
Filename
6101999
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