Title :
A high linearity, low noise amplifier module integrated with fail-safe bypass switch for tower mounted amplifier application
Author :
Lee, Hang-Kiong ; Fuad, Haji-Mokhtar
Author_Institution :
Wireless Semicond. Div., Avago Technol. Inc., Bayan Lepas, Malaysia
Abstract :
The paper describes the design and realization of a high linearity, low noise amplifier (LNA) module integrated with fail-safe bypass switch for tower mounted amplifier application. In the LNA mode, the device achieves a very low noise figure of 0.75B while maintaining high return losses of 20dB simultaneously. Biased at low current 5V@ 100mA, the module is capable of delivering input P1dB of 3dBm, input third order interception point (IIP3) of 20dBm, and gain of 15.5dB across an entire design bandwidth of 1.85GHz to 1.98GHz. In the bypass mode, the device offers a very low insertion loss of 0.8dB while achieving at least 55dB isolation between alternate paths to eliminate the possibility of oscillation issue. The MMIC LNA is fabricated in a chip size of 650 × 700um2 using a proprietary 0.25um E-mode pHEMT technology and is housed in a 7 × 10mm2 multi-chip-on-board (MCOB) package.
Keywords :
MMIC amplifiers; chip-on-board packaging; high electron mobility transistors; low noise amplifiers; E-mode pHEMT technology; MCOB package; MMIC LNA; current 100 mA; fail-safe bypass switch; high linearity; input third order interception point; low noise amplifier module; multichip-on-board package; oscillation; size 0.25 mum; tower mounted amplifier; voltage 5 V; FETs; Frequency measurement; Insertion loss; Noise figure; PIN photodiodes; Switches; Temperature measurement; Low noise amplifier; MMIC; bypass switch; pHEMT; towwer mounted amplifie;
Conference_Titel :
Microwave Integrated Circuits Conference (EuMIC), 2011 European
Conference_Location :
Manchester
Print_ISBN :
978-1-61284-236-3