DocumentCode
558588
Title
Antenna-in-package solution for millimeter-wave applications implemented in a microwave-compatible multilayer PCB technology
Author
Enayati, Amin ; Deraedt, Walter ; Vandenbosch, Guy A E ; Räisänen, Antti V.
Author_Institution
RFCDM Group, IMEC, Leuven, Belgium
fYear
2011
fDate
10-11 Oct. 2011
Firstpage
600
Lastpage
603
Abstract
A multi-layer PCB technology is used to implement an antenna-in-package solution for millimeter-wave-frequency applications. The antenna is a 1×2 array of dipoles fed by a vialess balun structure. The measurement and simulation results are compared for return loss and radiation pattern characteristics.
Keywords
antenna feeds; antenna radiation patterns; dipole antenna arrays; microwave circuits; millimetre wave antenna arrays; printed circuits; antenna radiation pattern; antenna-in-package solution; microwave-compatible multilayer PCB technology; millimeter-wave applications; vialess balun structure; Antenna arrays; Antenna measurements; Antenna radiation patterns; Arrays; Dipole antennas; Loss measurement; antenna-in-package solutions; millimete-wave frequencies;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Integrated Circuits Conference (EuMIC), 2011 European
Conference_Location
Manchester
Print_ISBN
978-1-61284-236-3
Type
conf
Filename
6102910
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