Title :
Trends and challenges in modern MEMS sensor packages
Author_Institution :
Robert Bosch GmbH, Reutlingen, Germany
Abstract :
Modern MEMS sensors for automotive as well as consumer electronics face a continuous pressure for size reduction. This can be met not only by a consistent shrink of sensing elements and ASICs resulting in a smaller package but also through the integration of several sensors into one system. The trends and challenges of this steady shrink will be explained and several examples of current automotive and consumer MEMS sensors will be shown.
Keywords :
application specific integrated circuits; automotive electronics; electric sensing devices; electronics packaging; micromechanical devices; ASIC; MEMS sensor packages; automotive sensors; consumer electronics; Automotive engineering; Lead;
Conference_Titel :
Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2011 Symposium on
Conference_Location :
Aix-en-Provence
Print_ISBN :
978-1-61284-905-8
