• DocumentCode
    559681
  • Title

    Forecasting analysis for global copper clad laminate market

  • Author

    Hsiao, Yu-Yao ; Wang, Fu-Kwun

  • Author_Institution
    Grad. Inst. of Manage., Nat. Taiwan Univ. of Sci. & Technol., Taipei, Taiwan
  • fYear
    2011
  • fDate
    24-26 Oct. 2011
  • Firstpage
    217
  • Lastpage
    221
  • Abstract
    Demand forecasting is one of critical reference by top managers to make the strategy decision for future investment. The copper clad laminate(CCL) is the key material for print circuit board(PCB) and it can apply for consumer, computer, LCD, communication, automotive, aero space, medicine and defense application. The total global sale for PCB in 2008 is US$ 48.2 billion. In this research, we use grey model GM(1, 1), rolling grey model(RGM) and Bass diffusion model to analysis global CCL market by six market segments - paper, composite, FR-4, FR-4 High Tg, FR-4 halogen free, Specialty between 2001-2008. The forecasting accuracy of global CCL market by six market segment was evaluated along with mean absolute percentage error(MAPE). In this study, Bass diffusion model MAPE outperforms the others two models GM(1, 1) and RGM for this global CCL market forecasting analysis and is recommend for global CCL market forecasting analysis.
  • Keywords
    claddings; copper; demand forecasting; grey systems; laminates; market opportunities; market research; printed circuits; time series; Bass diffusion model; GM(1,1) grey model; copper clad laminates; demand forecasting analysis; global CCL market forecasting analysis; investment; mean absolute percentage error; print circuit board; rolling grey model; Adaptation models; Analytical models; Data models; Forecasting; Integrated circuit modeling; Mathematical model; Predictive models; 1); Bass diffusion model; Copper clad laminate; GM(1; Print circuit board; Rolling GM;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Data Mining and Intelligent Information Technology Applications (ICMiA), 2011 3rd International Conference on
  • Conference_Location
    Macao
  • Print_ISBN
    978-1-4673-0231-9
  • Type

    conf

  • Filename
    6108432