Ultra compact O/E module for optical interconnection

Author

Ooyagi, Masaki ; Shimazu, Takayuki ; Sekiguchi, Tomoki ; Sano, Tomomi

Author_Institution

Opt. Commun. R&D Labs., Sumitomo Electr. Ind., Ltd., Yokohama, Japan

fYear

2011

fDate

Oct. 30 2011-Nov. 2 2011

Firstpage

1

Lastpage

2

Abstract

We are going to propose an optoelectronic ferrule called the LFI (Lead Frame Inserted) ferrule for application to optical interconnection modules. In this time, we have developed the LFI-Stab ferrule that is improved to become ultra compactly. This ferrule can be achieved high optical coupling efficiency by the optical fiber insertion and flip chip bonding the optical device. We have evaluated the fabricated LFI-Stab ferrule by measurement optical characteristics. Consequently, the LFI-Stab ferrule is able to apply for optical interconnection.

Keywords

flip-chip devices; integrated optoelectronics; optical fibre communication; optical fibre couplers; optical interconnections; optoelectronic devices; LFI-Stab ferrule; flip chip bonding; lead frame inserted ferrule; optical coupling efficiency; optical fiber insertion; optical interconnection; optical interconnection modules; optoelectronic ferrule; ultracompact O/E module; Bonding; Integrated optics; Lead; Optical devices; Optical variables measurement; Stimulated emission; Vertical cavity surface emitting lasers;

fLanguage

English

Publisher

ieee

Conference_Titel

Microopics Conference (MOC), 2011 17th

Conference_Location

Sendai

Print_ISBN

978-1-4577-1344-6

Type

conf

Filename

6110314