Title :
Ultra compact O/E module for optical interconnection
Author :
Ooyagi, Masaki ; Shimazu, Takayuki ; Sekiguchi, Tomoki ; Sano, Tomomi
Author_Institution :
Opt. Commun. R&D Labs., Sumitomo Electr. Ind., Ltd., Yokohama, Japan
fDate :
Oct. 30 2011-Nov. 2 2011
Abstract :
We are going to propose an optoelectronic ferrule called the LFI (Lead Frame Inserted) ferrule for application to optical interconnection modules. In this time, we have developed the LFI-Stab ferrule that is improved to become ultra compactly. This ferrule can be achieved high optical coupling efficiency by the optical fiber insertion and flip chip bonding the optical device. We have evaluated the fabricated LFI-Stab ferrule by measurement optical characteristics. Consequently, the LFI-Stab ferrule is able to apply for optical interconnection.
Keywords :
flip-chip devices; integrated optoelectronics; optical fibre communication; optical fibre couplers; optical interconnections; optoelectronic devices; LFI-Stab ferrule; flip chip bonding; lead frame inserted ferrule; optical coupling efficiency; optical fiber insertion; optical interconnection; optical interconnection modules; optoelectronic ferrule; ultracompact O/E module; Bonding; Integrated optics; Lead; Optical devices; Optical variables measurement; Stimulated emission; Vertical cavity surface emitting lasers;
Conference_Titel :
Microopics Conference (MOC), 2011 17th
Conference_Location :
Sendai
Print_ISBN :
978-1-4577-1344-6
