Quality Control for High-Speed Digital Multi-layer Printed Circuit Board

This paper analyses the process technology and defects of high-speed digital circuit multi-layer print board, and provides a set of effective quality control solutions for product acceptance, reliability evaluation, storage management for computer and communication manufacturers. In addition to listing IPC standards in product acceptance, it also highlights the testing items and methods that should be concerned. The paper sums up the reliability evaluation to three aspects, and provides two kinds of advanced testing and evaluation methods. Case analysis shows that the testing data and results of metallographic observations are consistent. For increasingly high-frequency, high-density multi-layer printed circuit board high-speed digital circuits, its quality control should be taken seriously enough.