• DocumentCode
    560460
  • Title

    Measurements and co-simulation of on-chip and on-board AC power noise in digital integrated circuits

  • Author

    Yoshikawa, Kumpei ; Sasaki, Yuta ; Ichikawa, Kouji ; Saito, Yoshiyuki ; Nagata, Makoto

  • Author_Institution
    Grad. Sch. of Syst. Inf., Kobe Univ., Kobe, Japan
  • fYear
    2011
  • fDate
    6-9 Nov. 2011
  • Firstpage
    76
  • Lastpage
    81
  • Abstract
    Power noise of an integrated circuit (IC) chip is dominantly characterized by the frequency-domain impedance of a chip-package-board integrated power delivery network (PDN) and the operating frequency of circuits. A 65 nm CMOS chip embedding a high precision on-chip waveform capture clearly exhibits the relation of AC power noise components with the parallel resonance seen from on-chip digital circuits. On-chip voltage noise measured by the waveform capture and on-board current noise by a near-field magnetic field probe are also experimentally related to each other, in the context of the resonance. In addition, fast power current analysis uses a capacitor charging model of digital circuits and embodies accurate co-simulation of AC power noise, along with a chip-package-board integrated PDN impedance model. A predictive measure in the design of IC chips is provided toward on-chip power supply integrity (PSI) as well as off-chip electromagnetic compatibility (EMC).
  • Keywords
    CMOS digital integrated circuits; capacitors; chip-on-board packaging; electromagnetic compatibility; microprocessor chips; CMOS chip embedding; capacitor charging; chip-package-board; digital integrated circuits; electromagnetic compatibility; frequency-domain impedance; integrated circuit chip; integrated power delivery network; near-field magnetic field probe; on-board AC power noise; on-board current noise; on-chip AC power noise; on-chip digital circuits; on-chip power supply integrity; on-chip voltage noise; on-chip waveform capture; power current analysis; Capacitors; Electromagnetic compatibility; Impedance; Integrated circuit modeling; Noise; System-on-a-chip;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility of Integrated Circuits (EMC Compo), 2011 8th Workshop on
  • Conference_Location
    Dubrovnik
  • Print_ISBN
    978-1-4577-0862-6
  • Type

    conf

  • Filename
    6130054