DocumentCode
560471
Title
Resonant-free PDN design®
Author
Coenen, Mart ; Van Roermund, Arthur
Author_Institution
EMCMCC, Eindhoven, Netherlands
fYear
2011
fDate
6-9 Nov. 2011
Firstpage
207
Lastpage
212
Abstract
The design of power distribution networks (PDNs) on printed circuit board (PCB) structures, or even on interconnect structures inside IC packages, typically results, with or without decoupling capacitors added, in a network full of impedance resonances. These resonances functionally hamper fast digital and RF designs from several MHz up to the GHz-range onwards and are the root cause for many EMC issues. These resonances are caused both by the physical size and geometry of the PCB and the decoupling as well as the loading components added to that PCB. Utilizing the characteristic impedance of the adjacent supply and ground layers correctly, results in a resonant free supply PDN with an impedance which can be made very low over an extremely broad frequency range. This, in combination with `Kelvin contact´ decoupled ICs, assures that the low impedance of the PDN can be maintained and multiple decoupling capacitors are no longer needed near to the IC pins. This offers great advantages for PCB space allocation and opens opportunities to more efficient routing. This extended concept has been verified by simulations. Additional measurements were taken to validate the concept.
Keywords
distribution networks; electromagnetic compatibility; integrated circuit packaging; printed circuit design; EMC; IC packages; IC pins; Kelvin contact decoupled IC; PCB space allocation; PCB structures; RF designs; characteristic impedance; decoupling capacitors; digital designs; ground layers; impedance resonances; interconnect structures; loading components; power distribution networks; printed circuit board structures; resonant-free PDN design; Capacitance; Capacitors; Electromagnetic compatibility; Impedance; Integrated circuits; Kelvin; Resonant frequency; power distribution network (PDN); power integrity (PI); printed circuit board (PCB); resonant-free; signal integrity (SI) electromagnetic compatibility (EMC);
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility of Integrated Circuits (EMC Compo), 2011 8th Workshop on
Conference_Location
Dubrovnik
Print_ISBN
978-1-4577-0862-6
Type
conf
Filename
6130065
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