Title :
EMC-signatures of microcontrollers under thermal stress analyzed by FSV
Author :
Knockaert, Jos ; Ramd, Mohamed ; Malki, Mohamed E A ; Pissoort, Davy ; Baudry, David
Author_Institution :
Univ. Coll. of West-Flanders, Ghent Univ., Kortrijk, Belgium
Abstract :
The EMC-signature of devices containing microcontrollers can differ due to thermal or mechanical stress. Research is presented to prove the feature selective validation method (FSV) to be sensitive enough to analyze differences in signatures.
Keywords :
electromagnetic compatibility; microcontrollers; thermal stresses; EMC signatures; feature selective validation; mechanical stress; microcontrollers; thermal stress; Electromagnetic compatibility; Frequency division multiplexing; Frequency measurement; Integrated circuit modeling; Microcontrollers; Stress; Temperature measurement; EMC-signature; FSV; thermal stress;
Conference_Titel :
Electromagnetic Compatibility of Integrated Circuits (EMC Compo), 2011 8th Workshop on
Conference_Location :
Dubrovnik
Print_ISBN :
978-1-4577-0862-6
