• DocumentCode
    560490
  • Title

    EMC-signatures of microcontrollers under thermal stress analyzed by FSV

  • Author

    Knockaert, Jos ; Ramd, Mohamed ; Malki, Mohamed E A ; Pissoort, Davy ; Baudry, David

  • Author_Institution
    Univ. Coll. of West-Flanders, Ghent Univ., Kortrijk, Belgium
  • fYear
    2011
  • fDate
    6-9 Nov. 2011
  • Firstpage
    148
  • Lastpage
    152
  • Abstract
    The EMC-signature of devices containing microcontrollers can differ due to thermal or mechanical stress. Research is presented to prove the feature selective validation method (FSV) to be sensitive enough to analyze differences in signatures.
  • Keywords
    electromagnetic compatibility; microcontrollers; thermal stresses; EMC signatures; feature selective validation; mechanical stress; microcontrollers; thermal stress; Electromagnetic compatibility; Frequency division multiplexing; Frequency measurement; Integrated circuit modeling; Microcontrollers; Stress; Temperature measurement; EMC-signature; FSV; thermal stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility of Integrated Circuits (EMC Compo), 2011 8th Workshop on
  • Conference_Location
    Dubrovnik
  • Print_ISBN
    978-1-4577-0862-6
  • Type

    conf

  • Filename
    6130084
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=560490