Title :
The field application analysis of dynamic line rating system based on tension monitoring
Author :
Zhimin, He ; Yadong, Liu
Author_Institution :
Eng. Training Center, Shanghai Univ. of Eng. Sci., Shanghai, China
Abstract :
The dynamic line rating system can dynamically increase the transmission capability of transmission line, the asset utilization efficiency ratio and reliability of power supply. All of these meet the development requirements of smart grid. A dynamic line rating system based on measuring the tension of strain section is designed in the paper. Dynamic line rating (DLR) system can accurately calculate the average conductor temperature between strain section and the operating statys data of every span sag, assure power system safety while increasing the transmission rating. In this paper, the operating data sampled in a typical week are mainly analyzed. The result demonstrated that the tension and sag were stable and accurate, while taking the ambient temperature, wind speed and wind direction into account. Comparison was drawn between actual transmission line capacity and rated capacity. With the consideration of the margin, it is safe to increase the transmission capacity of power system by 20%-30% on average.
Keywords :
conductors (electric); electrical safety; power supply quality; power system measurement; power transmission lines; power transmission reliability; smart power grids; DLR system; asset utilization efficiency ratio; conductor temperature; dynamic line rating system; field application analysis; power supply reliability; power system safety; smart power grid; span sag; strain section tension measurement; tension monitoring; transmission capability; transmission line capacity; wind direction; wind speed; Conductors; Monitoring; Power transmission lines; Strain; Temperature measurement; Transmission line measurements; Wind speed; dynamic line rating(DLR); smart grid; span sag; strain section tension;
Conference_Titel :
Power Engineering and Automation Conference (PEAM), 2011 IEEE
Conference_Location :
Wuhan
Print_ISBN :
978-1-4244-9691-4
DOI :
10.1109/PEAM.2011.6135082