• DocumentCode
    560985
  • Title

    Inverse modeling of the button shear test

  • Author

    Hauck, T. Orsten ; Ding, Min ; Schmadlak, Ilko

  • Author_Institution
    Freescale Halbleiter Deutschland GmbH, Germany
  • fYear
    2011
  • fDate
    12-15 Sept. 2011
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This paper presents computational fracture analysis of the button shear test. The specimen under consideration is commonly used for the assessment of adhesion strength between encapsulating mold compounds and metal leadframes. The finite element method is applied for stress strain analysis of the shear test and for the extraction of fracture parameters for various crack configurations in the material interface. Impacts of geometry and loading conditions of the button shear setup onto load and the crack driving forces at the interface crack tip will be discussed. The simulation results will be correlated with existing experimental data for different material combinations. Means to an estimation of adhesion strength values from the button shear test will be provided.
  • Keywords
    adhesion; finite element analysis; mechanical testing; stress analysis; adhesion strength; button shear test; computational fracture analysis; crack configurations; crack driving forces; encapsulating mold compounds; finite element method; fracture parameters; interface crack tip; inverse modeling; loading conditions; material combinations; material interface; metal leadframes; stress strain analysis; Lead; Adhesion Strength; Delamination; Interface Fracture;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronics and Packaging Conference (EMPC), 2011 18th European
  • Conference_Location
    Brighton
  • Print_ISBN
    978-1-4673-0694-2
  • Type

    conf

  • Filename
    6142361