DocumentCode
560992
Title
Miniaturization - solder paste attributes for maximizing the print & reflow manufacturing process window
Author
Vijay, Karthik
Author_Institution
Indium Corp. of Eur., Milton Keynes, UK
fYear
2011
fDate
12-15 Sept. 2011
Firstpage
1
Lastpage
10
Abstract
Current technology drivers span a broad spectrum that include miniaturized hand-held devices where real estate is at a minimum as well as high density server assemblies that have high-reliability requirements. SMT (Surface Mount Technology) assembly consequently involves overcoming challenges that include- complex components such as sub-0.4mm CSPs, 01005s, LGAs; Area Ratios of 0.6 and below; Stencil apertures sub-250 microns dia, Stencil thicknesses between 75-110 microns; Solder-Mask vs Non-Solder-Mask defined pads; varied surface finishes such as OSP, ImAg; and long reflow profiles with reflow in air.
Keywords
reflow soldering; solders; surface mount technology; miniaturization; reflow manufacturing process window; solder paste attributes; surface mount technology; Apertures; Copper; Manganese; Shape;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronics and Packaging Conference (EMPC), 2011 18th European
Conference_Location
Brighton
Print_ISBN
978-1-4673-0694-2
Type
conf
Filename
6142369
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