Title :
Miniaturization - solder paste attributes for maximizing the print & reflow manufacturing process window
Author_Institution :
Indium Corp. of Eur., Milton Keynes, UK
Abstract :
Current technology drivers span a broad spectrum that include miniaturized hand-held devices where real estate is at a minimum as well as high density server assemblies that have high-reliability requirements. SMT (Surface Mount Technology) assembly consequently involves overcoming challenges that include- complex components such as sub-0.4mm CSPs, 01005s, LGAs; Area Ratios of 0.6 and below; Stencil apertures sub-250 microns dia, Stencil thicknesses between 75-110 microns; Solder-Mask vs Non-Solder-Mask defined pads; varied surface finishes such as OSP, ImAg; and long reflow profiles with reflow in air.
Keywords :
reflow soldering; solders; surface mount technology; miniaturization; reflow manufacturing process window; solder paste attributes; surface mount technology; Apertures; Copper; Manganese; Shape;
Conference_Titel :
Microelectronics and Packaging Conference (EMPC), 2011 18th European
Conference_Location :
Brighton
Print_ISBN :
978-1-4673-0694-2
