Title :
Development and characterization of 300mm large panel eWLB (embedded wafer level BGA)
Author :
Seung Wook Yoon ; Lin, Yaojian ; Marimuthu, Pandi C.
Author_Institution :
STATS ChipPAC Ltd., Singapore, Singapore
Abstract :
This paper will highlight some of the recent advancements in 300mm eWLB large panel development. Compared to 200mm case, 300mm large panel has more warpage and process issues due to its area increase. Thermo-mechanical simulation shows 100~150% more warpage with 300mm large panel compared to 200mm. So various design parameters were studied to optimized warpage, such as dielectric materials and thickness, molding compound thickness etc. This paper also presents study of process optimization for 300mm eWLB and on overall warpage behavior in different process steps. Finally 300mm eWLB test vehicles are fabricated and tested in JEDEC standard test conditions. It also describes mechanical characterization, reliability data including component/board level, challenges encountered and overcome, and future steps.
Keywords :
ball grid arrays; integrated circuit manufacture; integrated circuit reliability; integrated circuit testing; wafer level packaging; JEDEC standard test; ball grid arrays; dielectric materials; embedded wafer level BGA; size 200 mm; size 300 mm; thermo-mechanical simulation; warpage behavior; Electromagnetic compatibility; Materials; Semiconductor device modeling; US Department of Energy; 300mm large scale; Fanout WLP; embedded wafer level packaging (eWLB); process development; process optimization; reliability;
Conference_Titel :
Microelectronics and Packaging Conference (EMPC), 2011 18th European
Conference_Location :
Brighton
Print_ISBN :
978-1-4673-0694-2
