DocumentCode
561030
Title
Copper makes a lot of cents
Author
Flowers, Chris ; Owen, Martyn
Author_Institution
CSR, Cambridge, UK
fYear
2011
fDate
12-15 Sept. 2011
Firstpage
1
Lastpage
6
Abstract
Transitioning from gold to copper wirebonding can provide significant cost saving for the semiconductor industry. However the move to copper wirebonding is not without risk and this paper will address the measures of end product quality that are essential for reliable products in the commercial sector.
Keywords
copper; gold; lead bonding; Au; Cu; IMC; bHAST; semiconductor industry; wirebonding; Assembly; Moisture measurement; Reliability; Copper; IMC; bHAST; reliability; wirebond;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronics and Packaging Conference (EMPC), 2011 18th European
Conference_Location
Brighton
Print_ISBN
978-1-4673-0694-2
Type
conf
Filename
6142412
Link To Document