• DocumentCode
    561057
  • Title

    Microsoldering with short-pulsed IR laser

  • Author

    Hieber, H.

  • Author_Institution
    ICR, Weimar, Germany
  • fYear
    2011
  • fDate
    12-15 Sept. 2011
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    A theoretical and experimental study investigates the minimum obtainable volume of soft soldered contacts to be made with an IR laser source. The parameters include the heat transfer and the surface energy of the liquid solder pool. The process is separated into a preheating step for the flux activation in the fine-grained solder paste, and into a melting and an overheating step. After switching-off the laser power a constitutional undercooling with the formation of intermetallics takes place. The optimization scheme considers the sensitivity of the calculated solder geometry with respect to the thermodynamic parameters for the state of equilibrium between power input, heat conduction and reflection of radiation.
  • Keywords
    cooling; electronics packaging; geometry; heat conduction; laser materials processing; melting; optimisation; soldering; solders; electronics packaging; fine-grained solder paste; flux activation; heat conduction; heat transfer; intermetallic formation; liquid solder pool; microsoldering; optimization scheme; overheating step; preheating step; radiation reflection; short-pulsed IR laser source; soft soldered contact; solder geometry calculation; surface energy; thermodynamic parameter; Heating; Laser applications; Laser beams; Metals; Power lasers; Soldering; Solid lasers; IR laser; Micro-soldering; soft-solder process data;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronics and Packaging Conference (EMPC), 2011 18th European
  • Conference_Location
    Brighton
  • Print_ISBN
    978-1-4673-0694-2
  • Type

    conf

  • Filename
    6142440