DocumentCode :
561057
Title :
Microsoldering with short-pulsed IR laser
Author :
Hieber, H.
Author_Institution :
ICR, Weimar, Germany
fYear :
2011
fDate :
12-15 Sept. 2011
Firstpage :
1
Lastpage :
5
Abstract :
A theoretical and experimental study investigates the minimum obtainable volume of soft soldered contacts to be made with an IR laser source. The parameters include the heat transfer and the surface energy of the liquid solder pool. The process is separated into a preheating step for the flux activation in the fine-grained solder paste, and into a melting and an overheating step. After switching-off the laser power a constitutional undercooling with the formation of intermetallics takes place. The optimization scheme considers the sensitivity of the calculated solder geometry with respect to the thermodynamic parameters for the state of equilibrium between power input, heat conduction and reflection of radiation.
Keywords :
cooling; electronics packaging; geometry; heat conduction; laser materials processing; melting; optimisation; soldering; solders; electronics packaging; fine-grained solder paste; flux activation; heat conduction; heat transfer; intermetallic formation; liquid solder pool; microsoldering; optimization scheme; overheating step; preheating step; radiation reflection; short-pulsed IR laser source; soft soldered contact; solder geometry calculation; surface energy; thermodynamic parameter; Heating; Laser applications; Laser beams; Metals; Power lasers; Soldering; Solid lasers; IR laser; Micro-soldering; soft-solder process data;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microelectronics and Packaging Conference (EMPC), 2011 18th European
Conference_Location :
Brighton
Print_ISBN :
978-1-4673-0694-2
Type :
conf
Filename :
6142440
Link To Document :
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