DocumentCode :
561060
Title :
Copper wire bond investigation on multiple surface finishes - enabling wire bond packages without gold
Author :
Oezkoek, Mustafa ; White, Nigel ; Clauberg, Horst
Author_Institution :
Atotech Deutschland GmbH, Berlin, Germany
fYear :
2011
fDate :
12-15 Sept. 2011
Firstpage :
1
Lastpage :
6
Abstract :
During the past two years, fine pitch copper wire bonding has finally entered high volume production. It is estimated that nearly 15% of all wire bonders used in production are now equipped for copper wire bonding. Most of these are used exclusively for copper wire bonding. In terms of pitch, copper wire is only barely lagging behind the most advanced gold applications. The most commonly used copper wire is 20um in diameter and 18um copper wire is entering final qualification. Evaluations with even finer wire are underway.
Keywords :
copper; electronics packaging; lead bonding; surface finishing; Cu; copper wire bond investigation; fine pitch copper wire bonding; multiple surface finishes; wire bond packages; Copper; Gold; Nickel; Plasmas; Reliability; Silver; Wires; ENEP; ENEPIG; copper wire bonding; gold wire bonding; pure Palladium; wire bonding;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microelectronics and Packaging Conference (EMPC), 2011 18th European
Conference_Location :
Brighton
Print_ISBN :
978-1-4673-0694-2
Type :
conf
Filename :
6142443
Link To Document :
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