DocumentCode :
563494
Title :
Transfer efficiency of e-beam fabricated C4D´S
Author :
Krambeck, R.H. ; Retajczyk, T.F., Jr. ; Yau, L.D.
Author_Institution :
Bell Labs., Murray Hill, NJ, USA
fYear :
1974
fDate :
9-11 Dec. 1974
Firstpage :
248
Lastpage :
250
Abstract :
In this work a quantitative analysis of the low frequency loss mechanisms of the Conductively Connected CCD will be presented. It will be shown that the loss is caused by changes in the shape and height of the implanted potential carrier. The loss is approximately inversely proportional to feature size and directly proportional to oxide thickness. Experimental data on electron beam fabricated devices will be given that shows good agreement with the theoretical calculations. It will be shown that for a 500 Å oxide, usable devices were made with areas as small as 125 μ2 (.2mil2) per bit.
Keywords :
charge-coupled devices; C4D fabrication; conductively connected CCD; e-beam; electron beam fabricated devices; implanted potential carrier; low frequency loss mechanisms; oxide thickness; quantitative analysis; transfer efficiency; Abstracts; Capacitance; Fabrication; Frequency modulation; Shape; Substrates;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting (IEDM), 1974 International
Conference_Location :
Washington, DC
ISSN :
0163-1918
Type :
conf
DOI :
10.1109/IEDM.1974.6219757
Filename :
6219757
Link To Document :
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