DocumentCode :
56391
Title :
Analysis of the Excellent Memory Disturb Characteristics of a Hourglass-Shaped Filament in Al2O3/Cu-Based CBRAM Devices
Author :
Belmonte, Attilio ; Celano, Umberto ; Redolfi, Augusto ; Fantini, Andrea ; Muller, Robert ; Vandervorst, Wilfried ; Houssa, Michel ; Jurczak, Malgorzata ; Goux, Ludovic
Author_Institution :
Imec, Leuven, Belgium
Volume :
62
Issue :
6
fYear :
2015
fDate :
Jun-15
Firstpage :
2007
Lastpage :
2013
Abstract :
All resistive switching memory devices face a critical voltage-time dilemma, as they require fast write at moderate voltage together with disturb immunity at lower (read) voltage. In this paper, excellent voltage-time characteristics are demonstrated on a 90-nm CMOS-friendly W/Al2O3/TiW/Cu conductive-bridging memory cell. The switching voltage was evaluated in the large write pulsewidth range between 10 ns and 10 s, from which a very low slope of ~75 mV/decade was extracted. These characteristics allow, on the one hand, a fast switching (10 ns) at <;3 V, and, on the other hand, excellent voltage-disturb immunity extrapolated to ±0.5 V for 10 years. Both constant-voltage-stress and read-endurance tests supported these predictions. By means of conductive-atomic-force microscopy tomography, the hourglass shape of the Cu filament was evidenced. Both the more distributed electrical field induced by this shape along the filament and the analysis of a charge-transfer (redox) reaction as rate-limiting mechanism in the switching process are discussed as the origins of this excellent disturb immunity.
Keywords :
CMOS memory circuits; aluminium compounds; atomic force microscopy; charge exchange; copper; oxidation; random-access storage; reduction (chemical); titanium compounds; tungsten; CBRAM devices; CMOS-friendly memory cell; W-Al2O3-TiW-Cu; charge transfer reaction; conductive-atomic-force microscopy tomography; conductive-bridging memory cell; conductive-bridging random access memory; constant-voltage-stress; hourglass-shaped filament; memory disturb characteristics; rate-limiting mechanism; read-endurance tests; redox reaction; resistive switching memory devices; size 90 nm; switching process; switching voltage; time 10 ns to 10 s; voltage-disturb immunity; voltage-time characteristics; Aluminum oxide; Mathematical model; Resistance; Shape; Stress; Switches; Tomography; Charge-transfer reaction; ECM; conductive-atomic-force microscopy (C-AFM); conductive-bridging; conductive-bridging random access memory (CBRAM); constant voltage stress (CVS); memory disturb; quantum point contact (QPC); read endurance; voltage-time dilemma; voltage-time dilemma.;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2015.2423094
Filename :
7103322
Link To Document :
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