• DocumentCode
    56404
  • Title

    Split-Gate-Enhanced Power UMOSFET With Soft Reverse Recovery

  • Author

    Ying Wang ; Wen-Li Jiao ; Hai-Fan Hu ; Yun-Tao Liu ; Jing Gao

  • Author_Institution
    Coll. of Inf. & Commun. Eng., Harbin Eng. Univ., Harbin, China
  • Volume
    60
  • Issue
    6
  • fYear
    2013
  • fDate
    Jun-13
  • Firstpage
    2084
  • Lastpage
    2089
  • Abstract
    A split-gate-enhanced power UMOSFET integrated with Schottky element is studied. In this device, a Schottky rectifier is integrated into every unit cell of the split-gate-enhanced UMOSFET (SGE-UMOS). 2-D simulations show that the device can achieve a low forward voltage drop of 0.48 V, around 28% lower than the 0.78 V of an SGE-UMOS. Numerical simulation also shows a 38% reduction in the reverse recovery time and three times improvement in the softness factor at a breakdown voltage (BV) of 150 V when compared with SGE-UMOS at room temperature. By reducing the width of the Schottky rectifier electrode, a further reduction in the leakage current until approaching the SGE-UMOS can be obtained. The unclamped inductive switching and the reverse recovery characteristics at an elevated temperature of 400 K, and the ON-state and OFF-state BV versus temperature are also studied.
  • Keywords
    electric breakdown; electric potential; electrochemical electrodes; leakage currents; numerical analysis; power MOSFET; rectifiers; switching convertors; 2D simulation; OFF-state BV; ON-state BV; SGE-UMOS; Schottky rectifier electrode; breakdown voltage; leakage current; numerical simulation; soft reverse recovery; split-gate-enhanced power UMOSFET; temperature 293 K to 298 K; temperature 400 K; unclamped inductive switching; voltage 0.48 V; voltage 150 V; voltage drop; Elevated temperature; ON-state characteristic; Schottky element; forward voltage drop; soft reverse recovery; split-gate-enhanced (SGE); unclamped inductive switching (UIS);
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2013.2257789
  • Filename
    6515180