DocumentCode
564132
Title
Technology migration and thermal coupling
Author
Janicki, Marcin ; Zajac, Piotr ; Szermer, Michal ; Napieralski, Andrzej
Author_Institution
Dept. of Microelectron. & Comput. Sci., Tech. Univ. of Lodz, Lodz, Poland
fYear
2012
fDate
24-26 May 2012
Firstpage
319
Lastpage
322
Abstract
This paper presents the problem of ever increasing thermal coupling between integrated circuit components induced by the technology migration to newer technology nodes. All the discussions here are based on the results of static and dynamic thermal simulations of a test ASIC which contains a large matrix of heat sources.
Keywords
application specific integrated circuits; integrated circuit testing; ASIC testing; dynamic thermal simulations; heat sources; integrated circuit components; static thermal simulations; technology migration; thermal coupling; Application specific integrated circuits; Computer architecture; Couplings; Heating; Integrated circuit modeling; Solid modeling; Thermal analysis; Many-core architectures; technology migration; thermal coupling;
fLanguage
English
Publisher
ieee
Conference_Titel
Mixed Design of Integrated Circuits and Systems (MIXDES), 2012 Proceedings of the 19th International Conference
Conference_Location
Warsaw
Print_ISBN
978-1-4577-2092-5
Type
conf
Filename
6226208
Link To Document