Title :
Joint simulation of mixed-signal integrated circuits and printed circuit boards
Author :
Cederström, Love ; Graupner, Achim
Author_Institution :
Zentrum Mikroelektron. Dresden AG, Dresden, Germany
Abstract :
As system complexities and the market share of mixed signal products increase, design and test of integrated circuits (ICs) will become more difficult. This indicates that design of printed circuit boards (PCBs) for test must be integrated into the IC development flows. We propose software supported model translation to enable a method of joint simulation of a PCB and an IC in an integrated environment. The method employed can be shown to increase model coverage to more than 90 % for analog time domain models from some of the largest component suppliers. The benefits of this are demonstrated through analog simulations that reuse existing testbenches for an IC, uncovering potentially unstable transient effects arising from the combination of the IC and PCB.
Keywords :
circuit simulation; integrated circuit design; integrated circuit testing; mixed analogue-digital integrated circuits; printed circuit design; printed circuit testing; time-domain analysis; PCB simulation; analog time domain model; integrated circuit design; integrated circuit testing; mixed-signal IC simulation; mixed-signal integrated circuit simulation; printed circuit board simulation; software supported model translation; Integrated circuit modeling; Libraries; SPICE; Semiconductor device modeling; Semiconductor process modeling; circuit boards; circuit simulation; circuit testing; design methodology; joint simulation; mixed analog digital integrated circuits;
Conference_Titel :
Mixed Design of Integrated Circuits and Systems (MIXDES), 2012 Proceedings of the 19th International Conference
Conference_Location :
Warsaw
Print_ISBN :
978-1-4577-2092-5