DocumentCode :
564788
Title :
Inclined exposure and incomplete thermal reflow process for fabricating asymmetric microlens array
Author :
Lin, T.H. ; Hung, S.Y. ; Hung, C.H. ; Shen, M.H. ; Yang, H.
Author_Institution :
Grad. Inst. of Appl. Sci. & Technol., Nat. Taiwan Univ. of Sci. & Technol., Taipei, Taiwan
fYear :
2012
fDate :
25-27 April 2012
Firstpage :
214
Lastpage :
217
Abstract :
A novel fabrication method of tilted microlens array for light control films is developed to increase the efficiency of a liquid crystal display that can collect lateral light sources and improve the dazzling problem within the angle of view. Initially, the pattern allows UV exposure by placing a photoresist-coated substrate on an inclined fixture. An inclined photoresist column array is made with a round cross-section using the photolithography technique. During the incomplete thermal reflow processing, only the partial surface of photoresist column reaches the material glass transition temperature, which is transformed from a glassy state into a rubbery state. In order to minimize the structural surface energy and reduce the surface area, the surface of the inclined photoresist column forms the lens profile. With proper control of the thermal reflow temperature and time, the photoresist at the base will still maintain the original inclination and glassy state because it hasn´t reached the glass transition temperature. The experimental results show that the inclined exposure from different angles can precisely control the declination angle of the inclined photoresist column. It can then fabricate the asymmetrical microlens arrays with the tilted angle larger than 33° by using the upside-down substrate and incomplete thermal reflow method.
Keywords :
liquid crystal displays; microfabrication; microlenses; photolithography; photoresists; UV exposure; asymmetric microlens array fabrication; inclined exposure process; inclined photoresist column array; incomplete thermal reflow process; light control films; liquid crystal display; material glass transition temperature; photolithography technique; photoresist column partial surface; photoresist-coated substrate; round cross-section; structural surface energy; surface area reduction; thermal reflow temperature control; upside-down substrate; Arrays; Fabrication; Lenses; Lithography; Microoptics; Plastics; Resists;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2012 Symposium on
Conference_Location :
Cannes
Print_ISBN :
978-1-4673-0785-7
Type :
conf
Filename :
6235330
Link To Document :
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