DocumentCode
564795
Title
Surface embossing of LTCC during the lamination process
Author
Wilhelm, Stefan ; Desmulliez, Marc P Y
Author_Institution
Inst. for Integrated Syst. (IIS), Heriot-Watt Univ., Edinburgh, UK
fYear
2012
fDate
25-27 April 2012
Firstpage
181
Lastpage
184
Abstract
This paper presents an embossing technique that allows a reduction of manufacturing steps by patterning the top and bottom faces of an LTCC package during isostatic lamination using a structured metal sheet. Two examples of micro-channels and bump arrays are presented for self constrained ceramics HL2000.
Keywords
ceramic packaging; embossing; laminations; LTCC package; bump arrays; isostatic lamination; lamination process; low temperature cofired ceramics technology; microchannels; self constrained ceramics HL2000; structured metal sheet; surface embossing; Cavity resonators; Ceramics; Embossing; Lamination; Rough surfaces; Surface treatment; LTCC; embossing; packaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2012 Symposium on
Conference_Location
Cannes
Print_ISBN
978-1-4673-0785-7
Type
conf
Filename
6235337
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