Title :
Surface embossing of LTCC during the lamination process
Author :
Wilhelm, Stefan ; Desmulliez, Marc P Y
Author_Institution :
Inst. for Integrated Syst. (IIS), Heriot-Watt Univ., Edinburgh, UK
Abstract :
This paper presents an embossing technique that allows a reduction of manufacturing steps by patterning the top and bottom faces of an LTCC package during isostatic lamination using a structured metal sheet. Two examples of micro-channels and bump arrays are presented for self constrained ceramics HL2000.
Keywords :
ceramic packaging; embossing; laminations; LTCC package; bump arrays; isostatic lamination; lamination process; low temperature cofired ceramics technology; microchannels; self constrained ceramics HL2000; structured metal sheet; surface embossing; Cavity resonators; Ceramics; Embossing; Lamination; Rough surfaces; Surface treatment; LTCC; embossing; packaging;
Conference_Titel :
Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2012 Symposium on
Conference_Location :
Cannes
Print_ISBN :
978-1-4673-0785-7
