Title :
Design and control of an optical alignment system using a parallel XXY stage and four CCDs for micro pattern alignment
Author :
Lee, Hau-Wei ; Liu, Chien-Hung ; Chiu, Yu-Ying ; Fang, Te-Hua
Author_Institution :
Dept. of Software & Adv. Technol. Res., Chiuan-Yan Tech. Co., Ltd., Changhua, Taiwan
Abstract :
Recently, as the requirements of manufacture or inspection of semiconductor, MEMS, LED, LCD, touch panel and so on, vision servo and multi-Degree-of-Freedoms (DOF) alignment/compensation stage are integrated for high precise alignment. The general alignment method uses two CCDs to capture the image of the pattern, and the central positions of the pattern on the CCD are determined using computer, DSP or microprocessor etc. In this paper, the proposed system includes four CCDs, two alignment objects and a novel design three-DOF parallel stage. The alignment displacements represented δx, δy and δΘ are analyzed using forward kinematic analysis. A novel design three-DOF parallel stage called XXY stage uses to move the alignment displacement. Experiment results show that resolution of the used CCD is about 7 μm per pixel and the linear and angular positioning repeatability of the XXY stage are better than 1 μm and 20 arcsec. Alignment error is about ±1 pixel. Time of three times alignment is about 1.25 second.
Keywords :
charge-coupled devices; compensation; digital signal processing chips; image processing; inspection; micromechanical devices; optical variables control; semiconductor device manufacture; CCD; DSP; LCD; LED; MEMS; alignment displacements; angular positioning repeatability; forward kinematic analysis; high precise alignment; image capture; linear positioning repeatability; micropattern alignment; multidegree-of-freedoms alignment; optical alignment system control; parallel XXY stage; semiconductor inspection; semiconductor manufacturing; three-DOF parallel stage; touch panel; vision servo; Cameras; Charge coupled devices; Equations; Lamination; Pattern matching; Publishing; Software;
Conference_Titel :
Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2012 Symposium on
Conference_Location :
Cannes
Print_ISBN :
978-1-4673-0785-7