• DocumentCode
    564798
  • Title

    Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation

  • Author

    Costello, S. ; Strusevich, N. ; Flynn, D. ; Kay, R.W. ; Patel, M.K. ; Bailey, C. ; Price, D. ; Bennet, M. ; Jones, A.C. ; Desmulliez, M.P.Y.

  • Author_Institution
    Microsyst. Eng. Centre (MISEC), Heriot-Watt Univ., Edinburgh, UK
  • fYear
    2012
  • fDate
    25-27 April 2012
  • Firstpage
    98
  • Lastpage
    102
  • Abstract
    This paper presents the use of micro-particle imaging velocimetry (micro-PIV) to analyse fluid flow and hence ion replenishment in PCB micro-via during the electroplating process. Megasonic streaming is used to remove bubbles from blind micro-via and promote ion transportation within high aspect ratio PCB micro-via to enhance electrodeposition.
  • Keywords
    ageing; bubbles; copper; electroplating; flow visualisation; integrated circuit packaging; printed circuits; three-dimensional integrated circuits; blind micro-via; copper electrodeposition; electrodeposition enhancement; electroplating process; fluid flow; high aspect ratio PCB micro-via; ion replenishment; ion transportation; megasonic agitation; megasonic streaming; microPIV; microparticle imaging velocimetry; Copper; Filling; Fluid flow; Fluids; Industries; Microfluidics; Transportation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2012 Symposium on
  • Conference_Location
    Cannes
  • Print_ISBN
    978-1-4673-0785-7
  • Type

    conf

  • Filename
    6235340
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=564798