Title :
Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation
Author :
Costello, S. ; Strusevich, N. ; Flynn, D. ; Kay, R.W. ; Patel, M.K. ; Bailey, C. ; Price, D. ; Bennet, M. ; Jones, A.C. ; Desmulliez, M.P.Y.
Author_Institution :
Microsyst. Eng. Centre (MISEC), Heriot-Watt Univ., Edinburgh, UK
Abstract :
This paper presents the use of micro-particle imaging velocimetry (micro-PIV) to analyse fluid flow and hence ion replenishment in PCB micro-via during the electroplating process. Megasonic streaming is used to remove bubbles from blind micro-via and promote ion transportation within high aspect ratio PCB micro-via to enhance electrodeposition.
Keywords :
ageing; bubbles; copper; electroplating; flow visualisation; integrated circuit packaging; printed circuits; three-dimensional integrated circuits; blind micro-via; copper electrodeposition; electrodeposition enhancement; electroplating process; fluid flow; high aspect ratio PCB micro-via; ion replenishment; ion transportation; megasonic agitation; megasonic streaming; microPIV; microparticle imaging velocimetry; Copper; Filling; Fluid flow; Fluids; Industries; Microfluidics; Transportation;
Conference_Titel :
Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2012 Symposium on
Conference_Location :
Cannes
Print_ISBN :
978-1-4673-0785-7
