DocumentCode :
565208
Title :
PADE: A high-performance placer with automatic datapath extraction and evaluation through high-dimensional data learning
Author :
Ward, Samuel ; Ding, Duo ; Pan, David Z.
Author_Institution :
ECE Dept., Univ. of Texas at Austin, Austin, TX, USA
fYear :
2012
fDate :
3-7 June 2012
Firstpage :
756
Lastpage :
761
Abstract :
This work presents PADE, a new placement flow with automatic datapath extraction and evaluation. PADE applies novel data learning techniques to train, predict, and evaluate potential datapaths using high-dimensional data such as netlist symmetrical structures, initial placement hints and relative area. Extracted datapaths are mapped to bit-stack structures that are aligned and simultaneously placed with the random logic using SAPT [1], the SAPT, a placer built on top of SimPL [2]. Results show at least 7% average total Half-Perimeter Wire Length (HPWL) and 12% Steiner Wire Length (StWL) improvements on industrial hybrid benchmarks and at least 2% average total HPWL and 3% StWL improvements on ISPD 2005 contest benchmarks. To the best of our knowledge, this is the first attempt to link data learning, datapath extraction with evaluation, and placement and has the tremendous potential for pushing placement state-of-the-art for modern circuits which have datapath and random logics.
Keywords :
data handling; learning (artificial intelligence); logic circuits; HPWL; ISPD 2005 contest benchmarks; PADE; SAPT; SimPL; StWL; Steiner wire length; automatic datapath evaluation; automatic datapath extraction; bit-stack structures; half-perimeter wire length; high-dimensional data; high-dimensional data learning; high-performance placer; initial placement hints; netlist symmetrical structures; placement flow; random logic; relative area; Accuracy; Benchmark testing; Data mining; Feature extraction; Generators; Support vector machines; Training; Datapath; Extraction; Physical Design; Placement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design Automation Conference (DAC), 2012 49th ACM/EDAC/IEEE
Conference_Location :
San Francisco, CA
ISSN :
0738-100X
Print_ISBN :
978-1-4503-1199-1
Type :
conf
Filename :
6241590
Link To Document :
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