• DocumentCode
    565272
  • Title

    Improved tangent space based distance metric for accurate lithographic hotspot classification

  • Author

    Jing Guo ; Fan Yang ; Sinha, S. ; Chiang, Charles ; Xuan Zeng

  • Author_Institution
    Microelectron. Dept., Fudan Univ., Shanghai, China
  • fYear
    2012
  • fDate
    3-7 June 2012
  • Firstpage
    1169
  • Lastpage
    1174
  • Abstract
    A distance metric of patterns is crucial to hotspot cluster analysis and classification. In this paper, we propose an improved tangent space based metric for pattern matching based hotspot cluster analysis and classification. The proposed distance metric is an important extension of the well-developed tangent space method in computer vision. It can handle patterns containing multiple polygons, while the traditional tangent space method can only deal with patterns with a single polygon. It inherits most of the advantages of the traditional tangent space method, e.g., it is easy to compute and is tolerant with small variations or shifts of the shapes. Compared with the existing distance metric based on XOR of hotspot patterns, the improved tangent space based distance metric can achieve up to 37.5% accuracy improvement with at most 4.3× computational cost in the context of cluster analysis. The improved tangent space based distance metric is a more reliable and accurate metric for hotspot cluster analysis and classification. It is more suitable for industry applications.
  • Keywords
    computer vision; electronic design automation; lithography; pattern classification; pattern clustering; pattern matching; accurate lithographic hotspot classification; computer vision; hotspot cluster analysis; multiple polygons; pattern matching; tangent space based distance metric; Accuracy; Extraterrestrial measurements; Noise; Pattern matching; Shape; Turning; Classification; Distance Metric; Hotspot; Lithographic;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation Conference (DAC), 2012 49th ACM/EDAC/IEEE
  • Conference_Location
    San Francisco, CA
  • ISSN
    0738-100X
  • Print_ISBN
    978-1-4503-1199-1
  • Type

    conf

  • Filename
    6241654