• DocumentCode
    565273
  • Title

    Simultaneous flare level and flare variation minimization with dummification in EUVL

  • Author

    Fang, Shao-Yun ; Chang, Yao-Wen

  • Author_Institution
    Grad. Inst. of Electron. Eng., Nat. Taiwan Univ., Taipei, Taiwan
  • fYear
    2012
  • fDate
    3-7 June 2012
  • Firstpage
    1175
  • Lastpage
    1180
  • Abstract
    Extreme Ultraviolet Lithography (EUVL) is one of the most promising Next Generation Lithography (NGL) technologies. Due to the surface roughness of the optical system used in EUVL, the rather high level of flare (i.e., scattered light) becomes one of the most critical issues in EUVL. In addition, the layout density non-uniformity and the flare periphery effect (the flare distribution at the periphery is much different from that in the center of a chip) also induce a large flare variation within a layout. Both of the high flare level and the large flare variation could worsen the control of critical dimension (CD) uniformity. Dummification (i.e., tiling or dummy fill) is one of the flare compensation strategies to reduce the flare level and the flare variation for the process with a clear-field mask in EUVL. However, existing dummy fill algorithms for Chemical-Mechanical Polishing (CMP) are not adequate for the flare mitigation problem in EUVL due to the flare periphery effect. This paper presents the first work that solves the flare mitigation problem in EUVL with a specific dummification algorithm flow considering global flare distribution. The dummification process is guided by dummy demand maps, which are generated by using a quasi-inverse lithography technique. In addition, an error-controlled fast flare map computation technique is proposed and integrated into our algorithm to further improve the efficiency without loss of computation accuracy. Experimental results show that our flow can effectively and efficiently reduce the flare level and the flare variation, which may contribute to the better control of CD uniformity.
  • Keywords
    chemical mechanical polishing; masks; minimisation; surface roughness; ultraviolet lithography; chemical-mechanical polishing; clear-field mask; critical dimension uniformity; dummification; dummy demand maps; extreme ultraviolet lithography; flare compensation; flare level; flare periphery effect; flare variation minimization; global flare distribution; layout density nonuniformity; next generation lithography; quasiinverse lithography; surface roughness; Accuracy; Layout; Lithography; Merging; Minimization; Rough surfaces; Ultraviolet sources; Dummification; Extreme Ultraviolet Lithography; Flare; Manufacturability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation Conference (DAC), 2012 49th ACM/EDAC/IEEE
  • Conference_Location
    San Francisco, CA
  • ISSN
    0738-100X
  • Print_ISBN
    978-1-4503-1199-1
  • Type

    conf

  • Filename
    6241655