DocumentCode
565273
Title
Simultaneous flare level and flare variation minimization with dummification in EUVL
Author
Fang, Shao-Yun ; Chang, Yao-Wen
Author_Institution
Grad. Inst. of Electron. Eng., Nat. Taiwan Univ., Taipei, Taiwan
fYear
2012
fDate
3-7 June 2012
Firstpage
1175
Lastpage
1180
Abstract
Extreme Ultraviolet Lithography (EUVL) is one of the most promising Next Generation Lithography (NGL) technologies. Due to the surface roughness of the optical system used in EUVL, the rather high level of flare (i.e., scattered light) becomes one of the most critical issues in EUVL. In addition, the layout density non-uniformity and the flare periphery effect (the flare distribution at the periphery is much different from that in the center of a chip) also induce a large flare variation within a layout. Both of the high flare level and the large flare variation could worsen the control of critical dimension (CD) uniformity. Dummification (i.e., tiling or dummy fill) is one of the flare compensation strategies to reduce the flare level and the flare variation for the process with a clear-field mask in EUVL. However, existing dummy fill algorithms for Chemical-Mechanical Polishing (CMP) are not adequate for the flare mitigation problem in EUVL due to the flare periphery effect. This paper presents the first work that solves the flare mitigation problem in EUVL with a specific dummification algorithm flow considering global flare distribution. The dummification process is guided by dummy demand maps, which are generated by using a quasi-inverse lithography technique. In addition, an error-controlled fast flare map computation technique is proposed and integrated into our algorithm to further improve the efficiency without loss of computation accuracy. Experimental results show that our flow can effectively and efficiently reduce the flare level and the flare variation, which may contribute to the better control of CD uniformity.
Keywords
chemical mechanical polishing; masks; minimisation; surface roughness; ultraviolet lithography; chemical-mechanical polishing; clear-field mask; critical dimension uniformity; dummification; dummy demand maps; extreme ultraviolet lithography; flare compensation; flare level; flare periphery effect; flare variation minimization; global flare distribution; layout density nonuniformity; next generation lithography; quasiinverse lithography; surface roughness; Accuracy; Layout; Lithography; Merging; Minimization; Rough surfaces; Ultraviolet sources; Dummification; Extreme Ultraviolet Lithography; Flare; Manufacturability;
fLanguage
English
Publisher
ieee
Conference_Titel
Design Automation Conference (DAC), 2012 49th ACM/EDAC/IEEE
Conference_Location
San Francisco, CA
ISSN
0738-100X
Print_ISBN
978-1-4503-1199-1
Type
conf
Filename
6241655
Link To Document