DocumentCode :
56610
Title :
Transmission-Line Model for Field-to-Wire Coupling in Bundles of Twisted-Wire Pairs Above Ground
Author :
Spadacini, Giordano ; Grassi, Flavia ; Marliani, Filippo ; Pignari, Sergio A.
Author_Institution :
Dept. of Electron., Inf. & Bioeng., Politec. di Milano, Milan, Italy
Volume :
56
Issue :
6
fYear :
2014
fDate :
Dec. 2014
Firstpage :
1682
Lastpage :
1690
Abstract :
An approximate multiconductor transmission-line (MTL) model is developed for predicting the radiated susceptibility of bundles composed of twisted-wire pairs (TWPs) running above a ground plane, and illuminated by a nonuniform electromagnetic field. Through the use of averaged per-unit-length parameters and sampling of the incident electromagnetic field, the nonuniform MTL is modeled as an equivalent uniform MTL including common-mode (CM) voltage sources accounting for field-to-wire coupling effects. The proposed model is able to predict CM currents/voltages induced in the terminal loads of every TWP in the bundle. In particular, it is shown that the CM noise significantly differs depending on the position of the considered TWP in the bundle cross section. Comparison of results versus full-wave simulations validates accuracy and computational efficiency of the proposed model.
Keywords :
electromagnetic interference; multiconductor transmission lines; twisted pair cables; wires (electric); common mode noise; common mode voltage sources; field-to-wire coupling effects; multiconductor transmission line model; nonuniform electromagnetic field; twisted wire pairs above ground; Computational modeling; Couplings; Electromagnetics; Integrated circuit modeling; Load modeling; Method of moments; Wires; Common mode (CM) and differential mode (DM); field-to-wire coupling; multiconductor transmission-line (MTL) model; twisted-wire pair (TWP);
fLanguage :
English
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9375
Type :
jour
DOI :
10.1109/TEMC.2014.2327195
Filename :
6837421
Link To Document :
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