• DocumentCode
    566260
  • Title

    Advances of 3M™ wafer support system

  • Author

    Saito, Kazuta ; Webb, Richard J. ; Dronen, Blake R.

  • Author_Institution
    Sumitomo 3M Ltd., Sagamihara, Japan
  • fYear
    2012
  • fDate
    Jan. 31 2012-Feb. 2 2012
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This paper will provide a summary of the recent advances of 3M´s WSS temporary bonding systems in both process tools and adhesive.
  • Keywords
    adhesives; wafer bonding; 3M wafer support system; WSS temporary bonding systems; adhesive; process tools; Bonding; Force; Glass; Surface topography; Surface treatment; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    3D Systems Integration Conference (3DIC), 2011 IEEE International
  • Conference_Location
    Osaka
  • Print_ISBN
    978-1-4673-2189-1
  • Type

    conf

  • DOI
    10.1109/3DIC.2012.6262994
  • Filename
    6262994
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=566260