DocumentCode :
56771
Title :
Trapezoidal Microchannel Heat Sink With Pressure-Driven and Electro-Osmotic Flows for Microelectronic Cooling
Author :
Yong Han ; Yong Jiun Lee ; Xiaowu Zhang
Author_Institution :
Inst. of Microelectron., Agency for Sci., Technol. & Res., Singapore, Singapore
Volume :
3
Issue :
11
fYear :
2013
fDate :
Nov. 2013
Firstpage :
1851
Lastpage :
1858
Abstract :
Thermal performances of the trapezoidal microchannel heat sink (MCHS) with pure pressure driven flow (PDF), pure electro-osmotic flow (EOF) and combined flow have been investigated and compared, using the multiphysics software COMSOL. The feasibility and accuracy of the simulation scheme for the microchannel are carefully validated with available experimental and numerical results for both PDF and EOF. The effects of the electric potential and driving pressure on the performance of the MCHS have been studied under different conditions. The flow rate, thermal resistance, and Nusselt number are investigated to determine the characteristic behavior of the trapezoidal MCHS of various sidewall angles, height-width ratios, and hydraulic diameters.
Keywords :
cooling; heat sinks; microchannel flow; osmosis; thermal resistance; COMSOL; EOF; MCHS; Nusselt number; PDF; driving pressure; electric potential; electroosmotic flow; flow rate; microelectronic cooling; multiphysics software; pressure driven flow; thermal performances; thermal resistance; trapezoidal microchannel heat sink; Electric potential; Heat sinks; Heating; Microchannel; Numerical models; Thermal resistance; Driving pressure; electro-osmotic flow (EOF); thermal resistance; trapezoidal micro-channel heat sink (MCHS); volume flow rate;
fLanguage :
English
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
2156-3950
Type :
jour
DOI :
10.1109/TCPMT.2013.2272478
Filename :
6567900
Link To Document :
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