DocumentCode
56771
Title
Trapezoidal Microchannel Heat Sink With Pressure-Driven and Electro-Osmotic Flows for Microelectronic Cooling
Author
Yong Han ; Yong Jiun Lee ; Xiaowu Zhang
Author_Institution
Inst. of Microelectron., Agency for Sci., Technol. & Res., Singapore, Singapore
Volume
3
Issue
11
fYear
2013
fDate
Nov. 2013
Firstpage
1851
Lastpage
1858
Abstract
Thermal performances of the trapezoidal microchannel heat sink (MCHS) with pure pressure driven flow (PDF), pure electro-osmotic flow (EOF) and combined flow have been investigated and compared, using the multiphysics software COMSOL. The feasibility and accuracy of the simulation scheme for the microchannel are carefully validated with available experimental and numerical results for both PDF and EOF. The effects of the electric potential and driving pressure on the performance of the MCHS have been studied under different conditions. The flow rate, thermal resistance, and Nusselt number are investigated to determine the characteristic behavior of the trapezoidal MCHS of various sidewall angles, height-width ratios, and hydraulic diameters.
Keywords
cooling; heat sinks; microchannel flow; osmosis; thermal resistance; COMSOL; EOF; MCHS; Nusselt number; PDF; driving pressure; electric potential; electroosmotic flow; flow rate; microelectronic cooling; multiphysics software; pressure driven flow; thermal performances; thermal resistance; trapezoidal microchannel heat sink; Electric potential; Heat sinks; Heating; Microchannel; Numerical models; Thermal resistance; Driving pressure; electro-osmotic flow (EOF); thermal resistance; trapezoidal micro-channel heat sink (MCHS); volume flow rate;
fLanguage
English
Journal_Title
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
2156-3950
Type
jour
DOI
10.1109/TCPMT.2013.2272478
Filename
6567900
Link To Document