• DocumentCode
    56771
  • Title

    Trapezoidal Microchannel Heat Sink With Pressure-Driven and Electro-Osmotic Flows for Microelectronic Cooling

  • Author

    Yong Han ; Yong Jiun Lee ; Xiaowu Zhang

  • Author_Institution
    Inst. of Microelectron., Agency for Sci., Technol. & Res., Singapore, Singapore
  • Volume
    3
  • Issue
    11
  • fYear
    2013
  • fDate
    Nov. 2013
  • Firstpage
    1851
  • Lastpage
    1858
  • Abstract
    Thermal performances of the trapezoidal microchannel heat sink (MCHS) with pure pressure driven flow (PDF), pure electro-osmotic flow (EOF) and combined flow have been investigated and compared, using the multiphysics software COMSOL. The feasibility and accuracy of the simulation scheme for the microchannel are carefully validated with available experimental and numerical results for both PDF and EOF. The effects of the electric potential and driving pressure on the performance of the MCHS have been studied under different conditions. The flow rate, thermal resistance, and Nusselt number are investigated to determine the characteristic behavior of the trapezoidal MCHS of various sidewall angles, height-width ratios, and hydraulic diameters.
  • Keywords
    cooling; heat sinks; microchannel flow; osmosis; thermal resistance; COMSOL; EOF; MCHS; Nusselt number; PDF; driving pressure; electric potential; electroosmotic flow; flow rate; microelectronic cooling; multiphysics software; pressure driven flow; thermal performances; thermal resistance; trapezoidal microchannel heat sink; Electric potential; Heat sinks; Heating; Microchannel; Numerical models; Thermal resistance; Driving pressure; electro-osmotic flow (EOF); thermal resistance; trapezoidal micro-channel heat sink (MCHS); volume flow rate;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    2156-3950
  • Type

    jour

  • DOI
    10.1109/TCPMT.2013.2272478
  • Filename
    6567900