Preparation and characterization of ITO, NPB and Alq3 thin films on transparent clay substrate for flexible OLED applications

Author

Venkatachalam, S. ; Hayashi, H. ; Ebina, T. ; Nakamura, T. ; Nanjo, H.

Author_Institution

Res. Center for Compact Chem. Process, Adv. Inst. of Ind. Sci. & Technol. (AIST), Sendai, Japan

fYear

2012

fDate

4-6 July 2012

Firstpage

37

Lastpage

40

Abstract

Transparent flexible freestanding polymer doped clay (TPP-LiSA) films were prepared. The DTA curve of polymer doped clay showed an exothermic peak at the range of 260-315°C. Nanocrystalline ITO thin films were prepared on flexible clay substrate by ion beam sputtering method. The average optical transparency of ITO/clay is estimated as 70 %. NPB and Alq3 thin films were prepared on ITO/clay by vacuum evaporation method. The PL spectra of NPB and Alq3 thin films showed emission peaks at 435 and 540 nm, respectively. The J-V characteristics of Ag/NPB/ITO/Clay and Ag/Alq3/ITO/Clay showed the Ohmic behaviour. The J-V characteristic of Ag/Alq3/NPB/ITO/Clay showed nonlinear Schottky behaviour.

Keywords

Schottky barriers; clay; differential thermal analysis; indium compounds; nanostructured materials; ohmic contacts; organic light emitting diodes; photoluminescence; polymers; thin films; transparency; vacuum deposition; Ag; Ag-Alq3-ITO-clay; Ag-Alq3-NPB-ITO-clay; Ag-NPB-ITO-clay; Alq3 thin films; DTA curve; ITO; J-V characteristics; NPB thin films; PL spectra; TPP-LiSA; emission peaks; exothermic peak; flexible OLED applications; flexible clay substrate; ion beam sputtering method; nanocrystalline ITO thin films; nonlinear Schottky behaviour; ohmic behaviour; optical transparency; temperature 260 degC to 315 degC; transparent clay substrate; transparent flexible freestanding polymer doped clay films; vacuum evaporation method; Absorption; Indium tin oxide; Optical diffraction; Optical films; Polymers; Substrates;

fLanguage

English

Publisher

ieee

Conference_Titel

Active-Matrix Flatpanel Displays and Devices (AM-FPD), 2012 19th International Workshop on

Conference_Location

Kyoto

Print_ISBN

978-1-4673-0399-6

Type

conf

Filename

6294827