Title :
A Microphone Array on a Chip for High Spatial Resolution Measurements of Turbulence
Author :
Krause, Joshua S. ; Gallman, Judith M. ; Moeller, Mark J. ; White, Robert D.
Author_Institution :
Mech. Eng. Dept., Tufts Univ., Medford, MA, USA
Abstract :
A microelectromechanical systems-based microphone array on a chip has been developed and applied to aeroacoustic measurements. The array is designed to measure the fluctuating pressures present under a turbulent boundary layer (TBL). Each chip measures 1 cm2 and contains 64 individually addressable capacitively sensed microphones, with a center to center pitch of ~1.25 mm. Surface topology, including the packaging, is kept to less than 0.13 mm. Element-to-element sensitivity variation in the array is less than ±2.5 dB from least to most sensitive, and phase variation is less than ±6.5° (at 1 kHz). The microphone 3-dB bandwidth is 700 Hz to 200 kHz, and the microphones are linear to better than 0.3% at sound pressure levels up to 150-dB SPL. A unique switched architecture system electronics and packaging method are employed to reduce data acquisition channel count requirements, and to maintain a low surface roughness. The array has been applied to the measurement of single point turbulence spectra under a flat plate TBL in a flow duct at Mach numbers up to 0.6 and Reynolds numbers based on plate length of 107.
Keywords :
Mach number; aeroacoustics; boundary layer turbulence; capacitive sensors; data acquisition; flow measurement; flow sensors; microphone arrays; microsensors; packaging; pipe flow; plates (structures); pressure measurement; subsonic flow; surface roughness; Mach numbers; Reynolds numbers; aeroacoustic measurements; bandwidth 700 Hz to 200 kHz; capacitively sensed microphones; data acquisition channel count; duct flow; element-to-element sensitivity variation; flat plate; fluctuating pressures; frequency 1 kHz; high spatial resolution measurements; microelectromechanical systems-based microphone array; packaging; phase variation; plate length; single point turbulence spectra; sound pressure levels; surface roughness; surface topology; switched architecture system electronics; turbulent boundary layer; Arrays; Electrodes; Micromechanical devices; Microphones; Packaging; Silicon; Surface treatment; Microphone; aeroacoustic; aeroacoustic.; array; pressure; sensor; turbulence;
Journal_Title :
Microelectromechanical Systems, Journal of
DOI :
10.1109/JMEMS.2014.2307556