• DocumentCode
    569565
  • Title

    Runtime safety analysis for safe reconfiguration

  • Author

    Priesterjahn, Claudia ; Heinzemann, Christian ; Schäfer, Wilhelm ; Tichy, Matthias

  • Author_Institution
    Dept. of Comput., Univ. of Paderborn, Paderborn, Germany
  • fYear
    2012
  • fDate
    25-27 July 2012
  • Firstpage
    1092
  • Lastpage
    1097
  • Abstract
    Modern technical systems are increasingly built to exhibit self-x properties as, e.g., self-healing or self-optimization. For this, they require adaptation at runtime. This is even true for embedded or mechatronic systems which often operate in safety-critical environments. There, the effects of the adaptation with respect to safety must be analyzed carefully. However, not all parameters needed for safety analyses, e.g., the concrete system architecture, are known at design time. Consequently, safety analyses need to be executed during runtime. Current approaches of runtime safety analysis typically react to anomalies that already occurred in the system. Thus, unsafe system states cannot be excluded completely. We present a runtime safety analysis that prevents system states with an unacceptable risk that have not yet occurred. For this, we generate the reachable component structures at runtime and analyze them with respect to risk. The system is modified such that component structures with an unacceptable risk are not reachable any more and are thus prevented.
  • Keywords
    embedded systems; mechatronics; optimisation; safety-critical software; concrete system architecture; embedded systems; mechatronic systems; runtime safety analysis; safe reconfiguration; safety-critical environments; self-healing; self-optimization; self-x properties; unsafe system states; Hazards; Real time systems; Runtime; Sensors; Unified modeling language; Vehicles; robust systems; security and safety applications; self adaptive technologies;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Informatics (INDIN), 2012 10th IEEE International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4673-0312-5
  • Type

    conf

  • DOI
    10.1109/INDIN.2012.6300900
  • Filename
    6300900