DocumentCode
569588
Title
Framework for dynamic verification of multi-domain virtual platforms in industrial automation
Author
Mendoza, F. ; Pascal, Jean-Yves ; Nenninger, P. ; Becker, J.
Author_Institution
Corp. Res., ABB Germany Ltd., Ladenburg, Germany
fYear
2012
fDate
25-27 July 2012
Firstpage
935
Lastpage
940
Abstract
A crucial part in the development of embedded systems in the industrial automation domain is their verification using simulation-based techniques. A comprehensive set of domain-specific modeling and simulation tools are available for this purpose, but they can only focus on certain aspects of a design. This paper presents a co-simulation framework for bringing them together in a structured and standardized way. The results are multi-domain virtual platforms where overall dynamic verification is possible. The advantage of multi-domain simulation models becomes clear when one recalls that embedded systems are used to interface with a physical environment. Often, they are coupled and cannot be tested in separation. Having a framework where physical and digital domains can interact in a correct and reproducible manner opens up new possibilities for embedded system developers. We demonstrate the capabilities of our framework by adding a co-simulation scheme between SystemC and the VHDL-AMS simulator SMASH, and present its application in an industrial case study for the verification of a new Rogowski Current Coil Transducer (RCCT) electronic front end architecture and its embedded controller software algorithm.
Keywords
embedded systems; factory automation; formal verification; virtual manufacturing; RCCT electronic front end architecture; Rogowski current coil transducer; SMASH; SystemC; VHDL-AMS simulator; domain-specific modeling; domain-specific simulation; dynamic verification; embedded controller software algorithm; embedded systems; industrial automation; multidomain simulation models; multidomain virtual platforms; Computational modeling; Computer architecture; Embedded systems; Frequency modulation; Hardware; System-on-a-chip;
fLanguage
English
Publisher
ieee
Conference_Titel
Industrial Informatics (INDIN), 2012 10th IEEE International Conference on
Conference_Location
Beijing
Print_ISBN
978-1-4673-0312-5
Type
conf
DOI
10.1109/INDIN.2012.6301059
Filename
6301059
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